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NEC's SILICON MMIC LOW CURRENT AMPLIFIER UPC8179TK FOR MOBILE COMMUNICATIONS
FEATURES
* HIGH DENSITY SURFACE MOUNTING: 6 Pin Leadless Minimold Package (1.5 x 1.1 x 0.55 mm) * SUPPLY VOLTAGE: VCC = 2.4 to 3.3 V * HIGH EFFICIENCY: PO(1dB) = +2.0 dBm TYP at f = 1.0 GHz PO(1dB) = +0.5 dBm TYP at f = 1.9 GHz PO(1dB) = +0.5 dBm TYP at f = 2.4 GHz * POWER GAIN: GP = 13.5 dB TYP at f = 1.0 GHz GP = 15.5 dB TYP at f = 1.9 GHz GP = 16.0 dB TYP at f = 2.4 GHz * EXCELLENT ISOLATION: ISL = 43 dB TYP at f = 1.0 GHz ISL = 42 dB TYP at f = 1.9 GHz ISL = 42 dB TYP at f = 2.4 GHz * LOW CURRENT CONSUMPTION: ICC = 4.0 mA TYP AT VCC = 3.0 V * OPERATING FREQUENCY: 0.1 to 2.4 GHz (Output port LC matching) * LIGHT WEIGHT: 3 mg
2.0 0.2 0.48 0.48
1
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE TK
1.3 0.05 1.1 0.1 0.16 0.05
BOTTOM
6
2
5
3
4
0.2 0.1 0.9
0.55 0.03
0.11
+0.10 -0.05
DESCRIPTION
NEC's UPC8179TK is a silicon monolithic integrated circuit designed as an amplifier for mobile communications. This IC can realize low current consumption with external chip inductor. The incorporation of a chip identical to the conventional 6pin super minimold package (2.0 x 1.25 x 0.9 mm) PC8179TB in a 6-pin leadless minimold package (1.5 x 1.1 x 0.55 mm) has enabled a reduction in mounting area of 50 %. The PC8179TK is ideally suited to replace the PC8179TB for footprint reduction and increased design density. This IC is manufactured using NEC's 30 GHz fMAX UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/ migration. Thus this IC has excellent performance uniformity and reliability. NEC's stringent quality assurance and test procedures assure the highest performance. consistency and reliability.
UPC8179TK TK UNITS mA dB MIN 2.9 11.0 13.0 14.0 39.0 37.0 37.0 -0.5 -2.0 -3.0 - - - 4.0 4.0 6.0 TYP 4.0 13.5 15.5 16.0 43.0 42.0 42.0 2.0 0.5 0.5 5.0 5.0 5.0 7.0 7.0 9.0 MAX 5.4 15.5 17.5 18.5 - - - - - - 6.5 6.5 6.5 - - -
APPLICATION
* Buffer amplifiers for 0.1 to 2.4 GHz mobile communications systems.
ELECTRICAL CHARACTERISTICS,
PART NUMBER PACKAGE OUTLINE SYMBOLS ICC GP Power Gain, PARAMETERS AND CONDITIONS Circuit Current (no input signal) f = 1.0 GHz, PIN = -30 dBm f = 1.9 GHz, PIN = -30 dBm f = 2.4 GHz, PIN = -30 dBm f = 1.0 GHz, PIN = -30 dBm f = 1.9 GHz, PIN = -30 dBm f = 2.4 GHz, PIN = -30 dBm f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz f = 1.0 GHz, PIN = -30 dBm f = 1.9 GHz, PIN = -30 dBm f = 2.4 GHz, PIN = -30 dBm
(Unless otherwise specified, TA = +25C, VCC = VOUT = 3.0 V, ZS = ZL = 50, at LC matched Frequency)
ISOL
Isolation,
dB
P1dB
Output Power at 1 dB gain compression, Noise Figure,
dBm
NF
dB
RLIN
Input Return Loss, (without matching circuit)
dB
UPC8179TK ABSOLUTE MAXIMUM RATINGS1 (TA = 25C)
SYMBOLS VCC ICC PD TOP TSTG PIN PARAMETERS Supply Voltage Circuit Current Power Dissipation2 UNITS V mA mW C C dBm RATINGS 3.6 15 232 -40 to +85 -55 to +150 +5
RECOMMENDED OPERATING CONDITIONS
SYMBOLS VCC TA PARAMETERS Supply Voltage Operating Ambient Temperature UNITS MIN V C 2.4 -40 TYP MAX 3.0 +25 3.3 +85
Operating Temperature Storage Temperature Input Power
Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85C).
PIN CONNECTIONS
(Top View) (Bottom View)
6 5 4 6 5 4 1 2 3
PIN NO. 1 2 3 4 5 6 PIN NAME INPUT GND GND OUTPUT GND VCC
6C
Parameter ICC (mA) 1.9 1.9 4.0 4.0 2.8 4.2 5.6
1 2 3
Caution: pin arrangement differs from the conventional 6 pin super minimold type UPC8179TB -
SERIES PRODUCTS1 (TA = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 )
1.0 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11 39 -4.0 11 40 -5.5 13.5 13.5 12.5 12.5 23 44 43 39 38 40 +3.0 +2.0 -4.0 +2.5 -4.5 1.9 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11.5 40 -7.0 11.0 41 -8.0 15.5 15.5 13 15 17.5 42 42 37 34 35 +1.5 +0.5 -4.0 +0.5 -8.5 2.4 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11.5 38 -7.5 11.0 42 -8.0 15.5 16.0 - - - 41 42 - - - +1.0 +0.5 - - - Package
Part No. UPC8178TB UPC8178TK UPC8179TB UPC8179TK UPC8128TB UPC8151TB UPC8152TB Note: 1. Typical performance.
6 pin super minimold 6 pin leadless minimold 6 pin super minimold 6 pin leadless minimold 6 pin super minimold 6 pin super minimold 6 pin super minimold
SYSTEM APPLICATION EXAMPLE
Location examples in digital cellular
Low Noise Tr. RX DEMOD I Q
.N . SW
PLL
PLL
I 0 TX PA 90 Q
UPC8179TK EVALUATION BOARD, 0.9 GHz
Vcc P1 GND P2
VCC C2 C3 C4 C5
J2
C3C
PIN 1
Vcc
J1
IFin
C2 C3 C4
DEVICE ORIENTATION
RFout
C1 U1
C3C
C5 L1 C6
C1 IN 50 1
6 4 2,3,5
L1 OUT C6 50
UPC8179TK GETEK H=.028 Er=4.2
ADD TAB
COMPONENT LIST
FORM Chip Capacitor SYMBOL C6 C1, C5 C2, C3, C4 Chip Inductor L1 VALUE 1 pF 51 pF 1800 pF 10 nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes
EVALUATION BOARD, 1.9 GHz
Vcc P1 GND P2
PIN 1
VCC
C3C
Vcc
DEVICE ORIENTATION C2 C3 C4
C3 C2 C4 C5 C7 C8
J1
IFin
RFout
C1 U1
C3C
C7 C8 C5 L2 L1 C6
J2
C1 IN 50
UPC8179TK GETEK H=.028 Er=4.2
ADD TAB
6 1 4 2,3,5
L1
L2
C6 OUT 50
COMPONENT LIST
FORM Chip Capacitor SYMBOL C7, C8 C6 C1, C5 C2, C3, C4 Chip Inductor L2 L1 VALUE 10 pF .4 pF 51 pF 1000 pF 22 nH 2.7 nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes
UPC8179TK EVALUATION BOARD, 2.4 GHz
Vcc P1 GND P2
VCC
Vcc
C3C
PIN 1
C3 C2 C4 C8 C5 C7 L2 4 C6 2,3,5 50 L1 OUT
J1
IFin
C2
C3 C4
DEVICE ORIENTATION
C8 C1 U1
C3C
RFout
C5
J2
C7
L2 L1 C6
C1 IN 50 1
6
UPC8179TK GETEK H=.028 Er=4.2
ADD TAB
COMPONENT LIST
FORM Chip Capacitor SYMBOL C7 C6 C1, C5 C2, C3, C4, C8 Chip Inductor L2 L1 VALUE 5.6 pF 0.5 pF 51 pF 1000 pF 3.9 nH 2.7 nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes
UPC8179TK TYPICAL SCATTERING PARAMETERS (TA = 25C)
+90 +135 +45 +135 S21 +90 +45
+180
2
4
6 S11
8
10 +0
+180
1
2
3
4 +0
S22 -135 -90
VCC = VOUT = 3.0 V FREQUENCY S11 GHz 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800 0.900 1.000 1.100 1.200 1.300 1.400 1.500 1.600 1.700 1.800 1.900 2.000 2.100 2.200 2.300 2.400 2.500 2.600 2.700 2.800 2.900 3.000 MAG (lin) 0.84 0.71 0.62 0.57 0.53 0.51 0.50 0.49 0.48 0.48 0.48 0.48 0.48 0.48 0.47 0.47 0.46 0.46 0.45 0.44 0.43 0.42 0.41 0.40 0.39 0.39 0.38 0.37 0.37 0.36 ANG (deg) -15.44 -23.58 -26.85 -27.79 -28.46 -29.20 -30.41 -31.91 -33.73 -35.99 -38.71 -41.75 -45.45 -49.58 -54.02 -58.93 -64.06 -69.22 -74.64 -80.15 -85.84 -91.30 -97.01 -102.52 -107.66 -112.50 -117.21 -121.34 -125.50 -129.41 MAG (lin) 0.000 0.001 0.003 0.004 0.004 0.005 0.005 0.006 0.006 0.006 0.007 0.007 0.006 0.006 0.006 0.006 0.005 0.006 0.005 0.005 0.005 0.004 0.004 0.004 0.005 0.005 0.005 0.005 0.005 0.006 S21 ANG (deg) 144.28 74.92 79.88 74.10 69.27 64.73 57.60 55.38 52.35 50.82 46.83 44.54 43.45 40.78 41.20 41.10 46.39 41.00 41.04 46.54 48.59 58.65 70.83 78.30 83.94 86.81 91.39 100.87 108.40 110.47 MAG (lin) 1.10 1.11 1.18 1.29 1.43 1.58 1.76 1.94 2.14 2.34 2.54 2.74 2.94 3.14 3.32 3.48 3.63 3.75 3.85 3.92 3.95 3.98 3.97 3.95 3.90 3.86 3.79 3.73 3.64 3.57 S12 ANG (deg) -177.39 -172.09 -167.46 -163.89 -162.03 -161.77 -162.65 -164.38 -167.03 -170.16 -174.19 -178.44 176.74 171.66 166.25 160.62 154.76 148.78 142.70 136.64 130.61 124.75 119.03 113.51 108.09 103.05 97.97 93.14 88.56 84.13 MAG (lin) 1.00 0.99 0.98 0.97 0.97 0.96 0.95 0.94 0.94 0.93 0.92 0.92 0.91 0.90 0.90 0.89 0.88 0.88 0.87 0.87 0.86 0.86 0.86 0.86 0.85 0.85 0.85 0.85 0.85 0.85 S22 ANG (deg) -1.76 -3.33 -4.59 -5.92 -7.05 -8.16 -9.33 -10.38 -11.45 -12.51 -13.62 -14.78 -15.97 -17.28 -18.52 -19.81 -21.15 -22.35 -23.73 -25.15 -26.53 -27.99 -29.67 -31.15 -32.65 -34.43 -35.87 -37.50 -39.28 -40.88 K MAG Unitless dB 0.21 3.26 2.99 3.20 3.64 3.83 3.87 3.64 3.54 3.41 3.29 3.28 3.53 3.56 3.67 4.05 4.19 4.06 4.76 4.90 5.61 6.26 7.20 6.49 5.82 5.48 6.19 6.53 5.80 5.16 33.63 20.89 18.84 17.29 16.66 16.34 16.49 16.74 17.08 17.48 17.79 18.12 18.29 18.55 18.71 18.93 19.03 19.12 19.06 19.06 18.93 18.88 18.71 18.60 18.38 18.33 18.08 17.91 17.71 17.50
-45
-135
-45 -90
Coordinates in Ohms Frequency in GHz
0.100 to 3.000 GHz by 0.100
Note: 1. Data taken at Device Under Test pins
UPC8179TK OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE TK
1.3 0.05 1.1 0.1 0.16 0.05
BOTTOM
2.0 0.2
0.48 0.48
1
6
2
5
3
4
0.2 0.1 0.9
0.55 0.03
0.11 +0.10 -0.05
ORDERING INFORMATION
PART NUMBER UPC8179TK-E2-A Note: Embossed tape, 8 mm wide. Pins 1, 2, 3 are in tape pull-out direction. QTY 3K/Reel
Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.
4/04/2006
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Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
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